Investigation On Microstructure of YA-TZP and Its Application for Wire Drawing Dies

Ge Changchun; Xia Yuanluo; Liu Guangzu

doi:10.13374/j.issn1001-053x.1991.s2.011

Volume 13 Issue S2

Oct. 2021

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Ge Changchun, Xia Yuanluo, Liu Guangzu. Investigation On Microstructure of YA-TZP and Its Application for Wire Drawing Dies[J]. Chinese Journal of Engineering, 1991, 13(S2): 61-64. doi: 10.13374/j.issn1001-053x.1991.s2.011

Citation:

Ge Changchun, Xia Yuanluo, Liu Guangzu. Investigation On Microstructure of YA-TZP and Its Application for Wire Drawing Dies[J]. Chinese Journal of Engineering, 1991, 13(S2): 61-64. doi: 10.13374/j.issn1001-053x.1991.s2.011

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Investigation On Microstructure of YA-TZP and Its Application for Wire Drawing Dies

doi: 10.13374/j.issn1001-053x.1991.s2.011

Laboratory of Special Ceramics and Powder Metallurgy

Received Date: 1991-06-13
Available Online: 2021-10-26

Abstract

Abstract

The properties of YA-TZP depend on its microstructures. Optimal combination of mechanical properties with σ_b =940~1010 MPa and K_1c=10.9 MPa√m was obtained as the critical grain size~0,7μm. No strength degradation after aging at 250℃ for 50h. The morphology of different phases in ZrO₂, the microcracks and particles of secondary phase wereinvestigated and dislocation networks and lines were found under TEM. Pre-liminary tests show good prospect on application for wire drawing dies.
- YA-TZP ceramic,
- microstructures,
- dislocation,
- wire drawing dies