Ag/Cu系的DIGM及遷移晶界擴散系數

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Ag/Cu系的DIGM及遷移晶界擴散系數

關卓明, 劉國勛, 杜娟

文章導航 > 工程科學學報 > 1993 > 15(1): 48-54

關卓明, 劉國勛, 杜娟. Ag/Cu系的DIGM及遷移晶界擴散系數[J]. 工程科學學報, 1993, 15(1): 48-54. doi: 10.13374/j.issn1001-053x.1993.01.009

引用本文:

關卓明, 劉國勛, 杜娟. Ag/Cu系的DIGM及遷移晶界擴散系數[J]. 工程科學學報, 1993, 15(1): 48-54. doi: 10.13374/j.issn1001-053x.1993.01.009

Guan Zhuoming, Liu Guoxun, Du Juan. DIGM and the Diffusion Coefficient Associated with the Migrated Boundaries in Ag/Cu System[J]. Chinese Journal of Engineering, 1993, 15(1): 48-54. doi: 10.13374/j.issn1001-053x.1993.01.009

Citation:

Guan Zhuoming, Liu Guoxun, Du Juan. DIGM and the Diffusion Coefficient Associated with the Migrated Boundaries in Ag/Cu System[J]. Chinese Journal of Engineering, 1993, 15(1): 48-54. doi: 10.13374/j.issn1001-053x.1993.01.009

關卓明, 劉國勛, 杜娟. Ag/Cu系的DIGM及遷移晶界擴散系數[J]. 工程科學學報, 1993, 15(1): 48-54. doi: 10.13374/j.issn1001-053x.1993.01.009

引用本文:

關卓明, 劉國勛, 杜娟. Ag/Cu系的DIGM及遷移晶界擴散系數[J]. 工程科學學報, 1993, 15(1): 48-54. doi: 10.13374/j.issn1001-053x.1993.01.009

Guan Zhuoming, Liu Guoxun, Du Juan. DIGM and the Diffusion Coefficient Associated with the Migrated Boundaries in Ag/Cu System[J]. Chinese Journal of Engineering, 1993, 15(1): 48-54. doi: 10.13374/j.issn1001-053x.1993.01.009

Citation:

Guan Zhuoming, Liu Guoxun, Du Juan. DIGM and the Diffusion Coefficient Associated with the Migrated Boundaries in Ag/Cu System[J]. Chinese Journal of Engineering, 1993, 15(1): 48-54. doi: 10.13374/j.issn1001-053x.1993.01.009

Ag/Cu系的DIGM及遷移晶界擴散系數

doi: 10.13374/j.issn1001-053x.1993.01.009

材料科學與工程系

基金項目:

國家自然科學基金(58971046)

作者簡介:
關卓明,女,56歲,副教授

計量
- 文章訪問數: 236
- HTML全文瀏覽量: 86
- PDF下載量: 13
- 被引次數: 0
出版歷程
- 收稿日期: 1992-10-16
- 網絡出版日期: 2021-10-18

DIGM and the Diffusion Coefficient Associated with the Migrated Boundaries in Ag/Cu System

Department of Materials Science and Engineering

摘要: 用配有X-射線能譜儀的掃描電鏡及光學顯微鏡觀察了400℃、480℃及580℃,經不同時間,Ag膜/Cu塊擴散對中Ag沿Cu晶界擴散誘發的晶界遷移(DIGM)現象。根據遷移晶界的特征,選用與其特征相適應的擴散方程教學解,計算了遷移晶界與靜止晶界的擴散系數。
- Ag/Cu系 /
- 晶界誘發晶界遷移 /
- 晶界擴散誘發再結晶 /
- 遷移晶界擴散系數
Abstract: Using scanning election microscope equipped with X-ray energy dispersion spectrometer and optical microscope the phenomena of diffusion induced grainboundary migration (DIGM) caused by Ag diffusing along the grain boundaries of Cu in Ag(film)/Cu (bulk) diffusion couple annealed at 400℃,480℃ and 580℃ with various times was studied. Based on the characteristics of the migrated boundaries, the diffusion coefficient of Ag in the migrated grain boundary was calculated by an appropriate solution of the diffusion equation for the migrated boundary.
- Ag/Cu system /
- DIGM /
- DIR /
- diffusion coefficient of the migrated grain boundary

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計量

文章訪問數: 236
HTML全文瀏覽量: 86
PDF下載量: 13
被引次數: 0

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